BE Semiconductor Industries NV BESI

Latest Results (13.11.2025):

BE Semiconductor Industries NV BESI reported its Q2-25 financial results showing mixed performance: while Q2-25 revenue reached €148.1 million—up 2.8% from Q1-25—it fell by 2.1% compared to Q2-24 due to softness in mobile end markets. The results were marked by pressure on gross margins and net income, which was impacted by lower revenue, increased R&D spending, and higher interest expenses. Additionally, the half-year (H1-25) figures indicate continued challenges in mainstream assembly markets, even as the company strengthens its cash position following a significant Senior Note offering.

Revenue Performance

In Q2-25, BE Semiconductor Industries NV BESI achieved revenues of €148.1 million, reflecting a 2.8% sequential increase from Q1-25 and aligning with prior guidance, though revenue decreased 2.1% year-over-year compared to Q2-24, primarily due to weakness in mobile markets despite higher die attach shipments for mainstream computing applications.

Gross Margin and Net Income

The company’s gross margin for Q2-25 stood at 63.3%, a slight decline from Q1-25 and down by 1.7 points versus Q2-24, influenced by a less favorable product mix and forex headwinds. Net income was €32.1 million, increasing modestly by 1.9% compared to Q1-25 but showing a year-over-year decline of 23.4% against Q2-24, which also contributed to a reduced net margin of 21.6%.

Order Trends and Cash Position

Orders for Q2-25 came in at €128.0 million, down 3.0% from Q1-25 and significantly lower by 30.9% compared to Q2-24, reflecting challenges in the mobile and hybrid bonding segments. Meanwhile, the company bolstered its liquidity with cash and deposits reaching €490.2 million as of June 30, 2025, a substantial increase from the previous year, primarily due to the Senior Note offering in July 2024.

Outlook for Q3-25

Looking ahead to Q3-25, BE Semiconductor Industries NV BESI expects revenue to decline by 5-15% as compared to the €148.1 million reported in Q2-25. However, the company anticipates a significant increase in orders, driven by higher demand for hybrid bonding systems and die attach systems tailored for AI-related 2.5D computing applications, while gross margins are forecasted to experience further pressure due to adverse forex effects.